The flux removes the oxide layer on the surface of the soldering material through its own active material, and at the same time reduces the surface tension between the tin liquid and the material to be soldered, enhances the flow and infiltration performance of the tin liquid, and helps to complete the soldering.The oxide on the surface of the soldering material is cleaned by the activating substance in the flux, so that the solder alloy can be well combined with the soldered material and form a solder joint. In the process, the activator in the flux and other substances play a major role , These substances can quickly remove the oxide of the pad and component pins, and sometimes can protect the material to be welded from oxidation before the welding is completed.
